Underfill Adhesive
Underfill adhesives are used on CSP, BGA and UBGA board components. Its function is to fix components and fill the empty space between the board and the component. When applied, the underfill adhesive flows under the component and when heated it polymerizes increasing mechanical strength in order to fix the component, avoiding vibrations and displacement of the component.
The underfill adhesive is based on epoxy resin formulation, which is a polymer that offers high hardness and mechanical resistance when cured. It is necessary to use an oven or stove to cure the material, as it cures around 140 Fahrenheit degrees.
The adhesive provides high mechanical strength against failure or mechanical stress. The low viscosity of the adhesive allows it to fill voids below CSPs, BGAs or UBGAs.The Underfill adhesive can be reworked if necessary.
