Thermal Pad

The Thermal Pad was developed with the purpose of eliminating air gaps and improving heat exchange efficiency.

The Thermal Pad is applied in processors, chips in general, high power semiconductors and other components that need thermal management.

CODE	DESCRIPTION	APPLICATION
TG2030	Easy application, Reworkable, thermal conductivity of 2 W/m.K	Electronic Components Requiring Heat Transfer to Heatsinks.
TG5050	Easy application, Reworkable, thermal conductivity of 4W/m.K	Electronic Components Requiring Heat Transfer to Heatsinks.
TG6050	Easy application, Reworkable, thermal conductivity of 6W/m.K	Electronic Components Requiring Heat Transfer to Heatsinks.