Silicone Potting

Silicone Potting

Silicone potting for electronics is a condensation polymer that is obtained through polymerization reactions. Its main features are great stability, chemically inert, good flexibility, good electrical insulator, water repellent, good dissipation heat, long service life in harsh environments, exceptional heat resistance and allows rework, and melting the old resin when reapplied.

In the electronics industry it is commonly used for boards that need heat dissipation, rework and will be exposed to high temperatures. It is indicated to protect products against water, heat, noise, vibration and to help cool down integrated circuit boards. It keeps stable properties between -40 to 392°F (-40 to 200°C).

CODE DESCRIPTION COLOR VISCOSITY (CPS) OPERATION TIME (MIN) TACK FREE (MINUTES / 25oC) HARDNESS (SHORE) THERMAL CONDUCTIVITY (W/m.k) DIELETRIC STRENGHT (KV/mm)
8230 Flammability Resistance V-0. Good thermal conductivity Gray 3500 40 90 55A 0.70 18
8300 Good adhesion White 4300 60 70 55A 0.80 20
8125T Translucent. It has good adhesion. Colorless 1000 40 70 22A 0.24 20
8130 Silicone Gray for General Potting Black / White 2800 40 70 35A 0.40 20
ZR340 Silicone Gray for General Encapsulation. It has thermal conductivity. Gray 2500 - 3500 50 180 55A 0,8 W/m.K 25
ZR340T Colorless Silicone for General Encapsulation. It has thermal conductivity. Colorless 1000 - 1500 30 180 22A ___ 25
ZR500 Colorless silicone, soft and with excellent adhesion for General Potting. Indicated for rework Colorless 1900 - 2100 50 120 15A 0.2 18
8135 (Led5205) Black silicone, soft and with excellent adhesion for General Encapsulation. Indicated for rework. Black 2200 - 3200 40 120 40A ___ 20

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