LPMS – Low Pressure Molding System
The low pressure molding system process is used to encapsulate sensors, connectors, electronic circuits and many other sensitive devices that require over-injection, offering protection against dust, moisture, vibration and temperature variation. The process is carried out using equipment developed exclusively for the low pressure injection process, where melted material is injected into a mold cavity to cover the product to be protected.
The thermoplastic resins used in this process are polyamide-based materials developed especially for this type of application. These resins have high adhesion, low viscosity, different hardness, resistance to different chemical agents and other characteristics.
The Best Advantages of Low Pressure Molding:
- Application in a single process step, which allows for better results in productivity, repeatability, quality and cost reduction;
- Raw material can be 100% reused avoiding waste;
The Best Advantages of Low Pressure Molding:
Application in a single process step, which allows for better results in productivity, repeatability, quality and cost reduction;
Raw material can be 100% reused avoiding waste;
Best Benefits of Low Pressure Molding:
- Fragile electronic components are not damaged in the injection process;
- After injection, the resin polymerizes in approximately 30 seconds, depending on the applied layers thickness.
- Excellent adhesion and provides an excellent aesthetic touch.
- Harnesses, connectors, and electronic circuits are successfully molded without damaging components or stressing a fragile solder joint.
Protectronics offers complete solution for this process: Support in the design and development of your product, development and manufacture of molds, injection equipment, resins, and services. We are a reliable partner to meet your needs!