Epoxy Potting

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Epoxy Potting

Epoxy potting is a thermoset polymer that hardens when mixed with a catalyst. This resin hardening process is called Curing. The main features are high adhesion power, high hardness and mechanical resistance, and high resistance against solvents or chemical agents in general. It is applicable to protect products against impacts, vibrations, chemical agents, humidity and helps make electronic circuits and components confidential. It keeps stable properties between - 40 to 240 °F (-40 to 120°C).

CODE DESCRIPTION COLOR VISCOSITY (CPS) OPERATION TIME (MIN) TACK FREE (MINUTES / 25oC) HARDNESS (SHORE) THERMAL CONDUCTIVITY (W/m.k) DIELETRIC STRENGHT (KV/mm)
6102 General Potting Black 1800 35 60 min / 25 graus 80D 0.40 18
6112 General Encapsulation, Flammability (V-0 ,94) Black 3000 40 80 80D 0.65 18
6113 General Encapsulation, Low coefficient of thermal expansion Black 2500 60 360 80D 1.0 18
6118 Colorless encapsulation material, long service life Colorless 500 120 ____ 60D 0.2 18
6119 Soft adhesive, PVC material Colorless 600 >48h ____ 60D 0.2 18
6205 Structural adhesive Gray 9500 45 340 82D 0.40 18
6220 Rigid epoxy structural adhesive Black 21000 70 120 80D 0.4 18
6225 High thermal conductivity, low thermal spacing coefficient Black 20000 60 180 90D 1.0 18
6211-2jy Semi-fluid Epoxy Adhesive Gray 90000 30 60 80D 0.4 18
6005 Fast curing reaction Black / Colorless 11000 2 5 75D 0.24 20
6402 Low viscosity , one component adhesive Black _____ ____ _____ 85D ____ 20
6688-15 Low viscosity , one component adhesive Black _____ ____ _____ 85D 0.22 20
ZR102 General potting Black 700 - 1200 40 min / 25ºC 40 min 80D 0.4 20
ZR112 General potting, flammability (V-0 ,94) Black 1000 - 2000 40 min / 25ºC 40 min 85D 0.4 20
ZR108 Colorless encapsulation material, long service life Colorless 500 - 1000 40 min / 25ºC 40 min 80D _____ 20

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